chip ferrite bead revision february 13, 2014 1 / 4 @ socay electronics co., ltd. 2014 specifications are subject to change without notice. please refer to www.socay.com for current information. scgb1005-b series socay electronics co., ltd. www.socay.com u monolithic inorganic material construction u closed magnetic circuit avoids crosstalk u smd type & suitable for reflow and wave soldering u available in various sizes u excellent solderability and heat resistance u high reliability u with a sharp and frequency impedance characteristics which can effectively filter high frequency noise without attenuating high frequency signal filtering between analog and digital circuitry, clock generation circuitry, i/o interconnects, isolation between rf noisy circuits and logic devices susceptible to functional degradation, power supply filtering to prevent conducted rf energy from corrupting the power generation circuitry. sharp impedance characteristics can effectively minimize attenuation, high frequency emi prevention of lcd monitor, pda, computers, computer peripherals, cellular equipment, digital tv, digital cameras, audio/visual equipment, dvd, wireless communication devices, mp3. operating temperature range -40 ~ +125 o c storage condition less than 40 and 70% rh storage time 6 months max. soldering method reflow or wave soldering 1 series name 2 size code: the first two digitals : length(mm), the last two digitals : width(mm) 3 material code 4 impedance( ), 25% 5 fixed decimal point 6 rated current cod a=50ma b=80ma c=100ma d=150ma e=200ma f=300ma g=400ma h=500ma i=600ma j=700ma k=800ma 7 packaging: p - embossed paper tape, 7" reel t - embossed plastic tape, 7" reel 8 soldering : green parts: s - soldering lead-free f - lead-free for whole chip general technical data part numbering f eatures applications scgb 1005 b 60 1 e p f ( 1 ) ( 2 ) ( 3 ) ( 4 ) ( 5 ) ( 6 ) ( 7 ) ( 8 ) e .g.: 600=60 ? , 121=120 ?
chip ferrite bead revision february 13, 2014 2 / 4 @ socay electronics co., ltd. 2014 specifications are subject to change without notice. please refer to www.socay.com for current information. scgb1005-b series socay electronics co., ltd. www.socay.com part number impedance ( ) 25% test freq. (mhz) dcr ( ) (max.) rated current (ma) scgb1005b601fpf 600 100 0.60 300 SCGB1005B102EPF 1000 100 1.00 200 scgb1005b152dpf 1500 100 1.50 150 test level 250 mv test instruments l hp4291b rf impedance / material analyzer l hp4338a/b milliohm meter l agilent 8720es s-parameter network analyzer l hp6632b system dc power supply ** for special part number which is not shown in the above table, please refer to appendix. for lead free solder unit: mm symbol 1005 (eia 0402) l 1.00 0.10 w 0.50 0.10 t 0.50 0.10 e 0.25 0.10 construction & dimensions recommended soldering conditions electrical characteristics 25 150 200 217 260 pre-heating soldering 60~120 second 30 second 60~150 second time (sec.) temperature () l t e e w
chip ferrite bead revision february 13, 2014 3 / 4 @ socay electronics co., ltd. 2014 specifications are subject to change without notice. please refer to www.socay.com for current information. scgb1005-b series socay electronics co., ltd. www.socay.com unit: mm size a b c 1005 0.40~0.60 1.60~2.60 0.40~0.70 symbol 1005 paper w 8.00 0.10 p 2.00 0.05 e 1.75 0.05 f 3.50 0.05 d 1.55 0.05 d1 na p 4.00 0.10 p 0 10 na p2 2.00 0.05 a0 0.62 0.03 b0 1.12 0.03 k0(t) 0.60 0.03 t na part size(eia size) packaging option quantity 1005 (0402) 7 reel 10,000 the contents of a box 1005 (0402): 6 reels / inner box tape specifications recommended pad layout reel specifications & packaging direction of feed plastic carrier paper carrier
chip ferrite bead revision february 13, 2014 4 / 4 @ socay electronics co., ltd. 2014 specifications are subject to change without notice. please refer to www.socay.com for current information. scgb1005-b series socay electronics co., ltd. www.socay.com test item test condition criteria temperature cycle a. temperature : -40 ~ +85 b. cycle : 100 cycles c. dwell time : 30minutes measurement : at ambient temperature 24 hrs after test completion a. no mechanical damage b. induction value should be within 20 % of the initial value operational life a. temperature : 125 5 b. test time : 1000 hrs c. apply current : full rated current measurement : at ambient temperature 24 hrs after test completion a. no mechanical damage b. induction value should be within 20 % of the initial value biased humidity a. temperature : 40 2 b. humidity : 90 ~ 95 % rh c. test time : 1000 hrs d. apply current : full rated current measurement : at ambient temperature 24 hrs after test completion a. no mechanical damage b. induction value should be within 20 % of the initial value resistance to solder heat a. solder temperature : 260 5 b. flux : rosin c. dip time : 10 1 sec a. more than 95 % of terminal electrode should be covered with new solder b. no mechanical damage c. induction value should be within 20 % of the initial value adhesive test a. reflow temperature : 245 it shall be soldered on the substrate applying direction parallel to the substrate b. apply force(f) : 5 n test time : 10 sec a. no mechanical damage b. soldering the products on pcb after the pulling test force > 5 n rated current test a. apply current : full rated current / 5min temperature rise should be less than 25 steam aging test a. temperature : 93 b. test time : 4hrs others: 8hrs c. solder temperature : 235 5 d. flux : rosin e. dip time : 5 1 sec more than 95 % of terminal electrode should be covered with new solder reliability and test condition
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